Airpods Cu-Pd-Au & Rh/Ru Plating Equipment
Copper-Palladium-Gold Plating Equipment (JYC-CuPdAu-Series)
Built for the Most Precise Electronic Applications
IC substrates, advanced semiconductor packaging, and microwave RF devices. These products demand high signal integrity. Our Copper-Palladium-Gold Plating Equipment is designed for them. The coating structure has three layers: copper, palladium, and gold. The copper layer handles conductivity and heat dissipation. The palladium layer is a diffusion barrier. It prevents copper from migrating to the gold layer. The gold layer provides solderability and corrosion resistance. Palladium thickness is typically 0.05 to 0.3 microns. Gold thickness is 0.03 to 0.1 microns. This stack meets IPC-4556 and JESD22-B111 drop impact test standards. It is especially good for RF front-end modules and memory chips. We have deep cooperation with China Electronics Technology Group in military and civilian high-end electronic plating.
Materials and Construction for Ultra-Clean Processing
We use perfluoropolymer (PFA) tanks and piping. This material prevents metal ion cross-contamination. Megasonic cleaning systems remove sub-micron particles effectively. The solution circulates through 0.2-micron polypropylene filter cartridges continuously. Closed-loop circulation prevents external contamination. Temperature control precision is ±0.3°C. The electroless palladium deposition rate is stable at 0.05 to 0.1 µm/min. Our SAP electroless copper plus pattern plating line for the Beijing Microelectronics Institute was 10 years ahead of domestic peers.
Three Core Advantages
First, a very thin palladium layer blocks copper diffusion.
Just 0.1 micron of palladium effectively stops copper from reaching the gold layer. In 150°C high-temperature storage tests, it withstands 2000 hours without discoloration. This is much better than traditional pure nickel barrier layers.
Second, the gold layer has excellent solderability.
With just 0.05 to 0.075 microns of gold, solderability stays good for over 30 days. Pads do not oxidize. Performance meets MIL-STD-883 method 2003 requirements.
Third, selective plating is available.
Spray plating modules and movable masks plate only specific areas like pads or under-bump metallization. Gold salt savings reach 40% to 60%.
What Buyers Often Ask
Buyers ask us: "Semiconductor customers have extremely high cleanliness requirements. Can you meet them?" Yes. We meet ISO 14644-1 Class 100 cleanroom level. We include online chemical concentration analyzers. These use CVS or XRF to automatically dose palladium salt and reducing agents. We provide roll-to-roll continuous plating lines or batch-type single-wafer processors. Equipment connects via SECS/GEM protocol. In our cases at China Electronics Technology and the Beijing Microelectronics Institute, our equipment has proven reliability in military and civilian high-end electronic plating.
Technical Specifications
|
Parameter |
Specification |
|
Palladium Layer Thickness |
0.05 – 0.3 µm |
|
Gold Layer Thickness |
0.03 – 0.1 µm |
|
Temperature Control Precision |
±0.3°C |
|
Palladium Deposition Rate |
0.05 – 0.1 µm/min |
|
High-Temperature Storage (150°C) |
≥ 2000 h (no discoloration) |
|
Solderability Retention |
≥ 30 days |
|
Gold Salt Savings |
40% – 60% (selective plating) |
|
Cleanroom Class |
ISO 14644-1 Class 100 |
|
Applicable Standards |
IPC-4556, JESD22-B111, MIL-STD-883 |
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