Nickel-Gold Plating Equipment
Nickel-Gold Plating Equipment (JYC-NG-Series)
Built for Precision Electronics
Semiconductor lead frames, PCB gold fingers, electronic connectors, and wafer bumps. These electronic components need high-precision plating. Our Nickel-Gold Plating Equipment serves this field. The coating structure is a nickel underlayer with a gold top layer. Nickel thickness is 2 to 5 microns. This blocks copper migration to the gold layer. Gold thickness is 0.05 to 1.5 microns. This depends on whether you need wire bonding or low contact resistance. Gold purity is 99.9%. Hardness is 60 to 130 HK. This meets MIL-G-45204 and ASTM B488. Our clients include China Electronics Technology Group, Beijing Microelectronics Institute, Shennan Circuits, and Foxconn.
Materials and Construction for High Cleanliness
We use high-purity PVC-U or PVDF tanks. These prevent metal ion cross-contamination. The solution circulation uses internal and external dual-stage filtration. Precision is 1 micron. Ultrasonic cleaning and electrolytic degreasing stations ensure substrate cleanliness at the micron level. We integrate movable masking or spray plating functionality. This enables selective plating. It greatly saves gold salt.
Three Core Advantages
First, thickness uniformity is excellent.
Programmable independent anodes and shielding plate technology are used. Combined with automatic voltage and current density distribution monitoring, coating uniformity is stable within ±10%.
Second, coating performance is outstanding.
The nickel layer is dense and pore-free. It blocks copper diffusion at 250°C. Gold layer contact resistance is below 1 milliohm. Wire bonding pull strength exceeds 10 grams. This meets wire bonding requirements.
Third, the entire process is automated.
Robotic loading and unloading systems with CCD vision positioning enable unmanned production. Process parameters like current, temperature, and time are traceable for every piece.
What Buyers Often Ask
Buyers ask us: "Electronic plating has high entry barriers. Can the equipment go into cleanrooms?" Yes. It meets Class 10 to 100 cleanroom requirements. We include a gold recovery system using ion exchange resin or electrolysis. Recovery rate exceeds 99%. All parameters connect to your factory automation system via SECS/GEM protocol. As a custom equipment maker, we provide everything from lab sample machines to large-scale roll-to-roll continuous plating systems.
Technical Specifications
|
Parameter |
Specification |
|
Nickel Layer Thickness |
2 – 5 µm |
|
Gold Layer Thickness |
0.05 – 1.5 µm |
|
Gold Purity |
≥ 99.9% |
|
Gold Layer Hardness |
60 – 130 HK |
|
Thickness Uniformity |
Within ±10% |
|
Contact Resistance |
< 1 mΩ |
|
Gold Recovery Rate |
> 99% |
|
Cleanroom Class |
Class 10 – 100 |
|
Applicable Standards |
MIL-G-45204, ASTM B488 |
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