El Ni-Pd-Au Equipment
Electroless Nickel-Palladium-Gold Equipment (JYC-ENEPIG-Series)
Built for Wire Bonding and Solderability Combined
High-end IC substrates, advanced semiconductor packages, and RF devices. These products need both wire bonding capability and good solderability. Our Electroless Nickel-Palladium-Gold Equipment produces the ENEPIG finish. The process starts with electroless nickel. Nickel thickness is 3 to 6 microns. Then we deposit a palladium layer. Palladium thickness is 0.05 to 0.2 microns. This palladium layer prevents gold and nickel from forming brittle intermetallics. Finally, a thin immersion gold layer is applied. Gold thickness is 0.03 to 0.08 microns. This finish meets IPC-4556. It is especially good for products that need both gold wire bonding and soldering on the same pad.
Materials and Construction for Multi-Layer Control
The equipment has separate tanks for nickel, palladium, and gold. Each tank has its own heating and filtration system. The electroless nickel tank runs at 82 to 88°C. The electroless palladium tank runs at 55 to 65°C. The immersion gold tank runs at 80 to 88°C. We use automatic chemical analyzers for each bath. These monitor concentration and replenish chemicals in real time. The result is consistent deposition across all three layers.
Three Core Advantages
First, the palladium layer prevents black pad defect.
In traditional ENIG, nickel can oxidize underneath the gold. This causes black pad and poor solder joints. The palladium barrier layer stops this. Solder joint strength is more reliable.
Second, wire bonding performance is excellent.
The palladium layer provides a stable base for gold wire bonding. Pull strength exceeds 10 grams. Bonding yields are consistently high. This is critical for semiconductor packaging.
Third, the process window is wide.
Our bath formulations tolerate a wider range of operating conditions. This makes the process more forgiving. Production downtime is reduced.
What Buyers Often Ask
Buyers ask us: "Semiconductor customers need reliable ENEPIG for mixed assembly. Can you meet their requirements?" Yes. We provide complete process control. Each tank has independent temperature and chemical monitoring. The system connects to MES for full traceability. Our ENEPIG equipment is already in use at major IC substrate manufacturers.
Technical Specifications
|
Parameter |
Specification |
|
Nickel Layer Thickness |
3 – 6 µm |
|
Palladium Layer Thickness |
0.05 – 0.2 µm |
|
Gold Layer Thickness |
0.03 – 0.08 µm |
|
Electroless Nickel Temperature |
82 – 88°C |
|
Electroless Palladium Temperature |
55 – 65°C |
|
Immersion Gold Temperature |
80 – 88°C |
|
Wire Bonding Pull Strength |
≥ 10 g |
|
Applicable Standards |
IPC-4556 |
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