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Product Introduction

Primary Copper Plating Equipment (JYC-PC-Series)

Built for PCB Through-Hole Metallization

PCB and IC substrate manufacturing has a key step called through-hole metallization. Our Primary Copper Plating Equipment does this. On the electroless copper already deposited on hole walls, we electroplate to build the primary copper layer. Thickness is typically 5 to 12 microns. This provides a conductive base for subsequent pattern plating. It ensures through-holes with diameters down to 0.15 mm and aspect ratios (board thickness divided by hole diameter) up to 12:1. Throwing power TP value exceeds 80%. It meets IPC-6012 Class 2 or 3 requirements. Our clients Shennan Circuits and Foxconn have verified this equipment's reliability.

Materials and Construction for Uniform Deposition

The main configurations are vertical continuous plating or horizontal spray plating. Tanks have independent segmented anodes using phosphorized copper balls. Cross-flow spray systems with individually adjustable flow rates for each nozzle are used. Cathode oscillation or vibration mechanisms remove bubbles from the board surface. All parameters including current density, spray pressure, and temperature are fully automatic closed-loop controlled by PLC. The equipment connects to MES systems. The SAP electroless copper plus pattern plating line we provided to the Beijing Microelectronics Institute was 10 years ahead of domestic peers.

Three Core Advantages

First, through-hole coverage is excellent.

Segmented current control with independently set high, medium, and low current densities at entry and exit is used. Current density inside the hole is compensated. The ratio of hole copper thickness to surface copper thickness TP reaches over 85%.

Second, surface copper thickness is uniform.

Flying bar automatic identification systems and current distribution simulation software are used. For different board sizes, copper thickness variation is controlled within ±1.5 microns.

Third, solution analysis is intelligent.

Cyclic voltammetric stripping (CVS) analyzers monitor additive concentrations (brightener, leveler, suppressor) in real time. Automatic dosing precision reaches ±0.5 mL/L.

What Buyers Often Ask

Buyers ask us: "PCB customers have very high requirements for hole copper thickness uniformity. What level can you achieve?" Bath temperature is 25±1°C. Current density is 1.5 to 2.5 A/dm² in the standard process window. Equipment floor space is 20% less than traditional layouts. We support special clamp designs for thin boards (0.05 mm) or thick boards (10 mm). We deliver not just equipment but complete process parameter optimization services. This ensures fast production startup with first-pass yield over 95%.

Technical Specifications

Parameter	Specification
Primary Copper Thickness	5 – 12 µm
Minimum Hole Diameter	≥ 0.15 mm
Maximum Aspect Ratio	≤ 12:1
TP Value (Throwing Power)	≥ 80% (up to 85%+)
Copper Thickness Variation	Within ±1.5 µm
Bath Temperature	25 ± 1°C
Current Density	1.5 – 2.5 A/dm²
Additive Dosing Precision	±0.5 mL/L
Floor Space Savings	20%
Applicable Standards	IPC-6012 Class 2/3

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