Spot Plating Equipment
Secondary Copper Plating Equipment (JYC-SC-Series)
Built for Fine-Line Pattern Plating
After PCB pattern transfer, copper needs to be selectively deposited in areas opened by dry film or wet film to build up the circuit traces. Our Secondary Copper Plating Equipment does this. It typically builds primary copper from 5 to 8 microns up to 20 to 35 microns (for through-holes) or 12 to 18 microns (for outer layer traces). It also protects the copper inside holes from being etched away. It supports fine-line processes with line width and spacing down to 25 microns. It meets IPC-6018 for high-frequency microwave boards and IPC-9252 for copper thickness testing. The equipment we provided to the Beijing Microelectronics Institute was 10 years ahead of domestic peers.Our technical maturity is leading.
Materials and Construction for Precision
The entire line uses vertical continuous plating (VCP) structure. Independent anodes with individually controlled current for each section are used. The rectifier is high-frequency pulse type with ripple coefficient below 2%. Key features include automatic water-blocking rollers and absorbent sponge rollers. These prevent solution cross-contamination. Solution circulation uses high-precision 5-micron filtration. This is combined with air agitation and cathode movement.
Three Core Advantages
First, trace uniformity is excellent.
Flying bar identification systems and non-linear current density distribution models are used. The system automatically compensates for current differences between board edges and centers. Copper thickness variation across the entire board is controlled within 10%.
Second, high aspect ratio capability is strong.
Strong spray and ultrasonic agitation are used. For through-holes with aspect ratios over 15:1, TP value still exceeds 70%. This prevents hole wall cracking.
Third, process management is refined..
Online CVS analysis systems monitor three or more organic additive concentrations in real time. They dynamically adjust dosing rates. The bath stays in optimal working condition.
What Buyers Often Ask
Buyers ask us: "HDI board and high-end PCB customers have very high trace uniformity requirements. Can you meet them?" Yes. Supported PCB board sizes range from 50×50 mm to 650×650 mm. Board thickness ranges from 0.1 to 7.0 mm. Current density range is 1 to 4 A/dm². Single rack load capacity is 30 to 60 boards per hour. The washing section uses multi-stage countercurrent rinsing. This is combined with deionized water and online conductivity monitoring. Water savings exceed 60%. We provide complete EPC solutions from primary copper to secondary copper to etching. The equipment has been verified at leading companies like Shennan Circuits and Foxconn.
Technical Specifications
|
Parameter |
Specification |
|
Through-Hole Copper Thickness |
20 – 35 µm |
|
Outer Layer Trace Copper Thickness |
12 – 18 µm |
|
Minimum Line Width/Spacing |
≥ 25 µm |
|
Copper Thickness Variation |
≤ 10% (entire board) |
|
Maximum Aspect Ratio |
≥ 15:1 (TP value > 70%) |
|
PCB Board Size |
50×50 – 650×650 mm |
|
Board Thickness Range |
0.1 – 7.0 mm |
|
Current Density Range |
1 – 4 A/dm² |
|
Rectifier Ripple Coefficient |
< 2% |
|
Water Savings |
> 60% |
|
Applicable Standards |
IPC-6018, IPC-9252 |
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